Within the CHIPS-JU NanoIC pilot line Tyndall is developing novel materials for embedded DRAM and 3D integration for future leading-edge integrated circuits. In NanoIC, Tyndall’s flexibility into materials integration will allow for rapid, short-cycle screening to reduce the cycle time in identifying and integrating highly performing materials to carry forward into IC development. Our role is to provide agile wafer scale nanofabrication and processing beyond silicon for the integration of selected new materials – Transition Metal Dichalcogenides (TMDs) and oxide semiconductor (OSC) – and FET device architectures. The NanoIC teams at Tyndall will synthesize thin film TMDs and OSCs and will fabricate and test a wide range of materials and devices. Other activities may include compound semiconductors devices, wide band gap materials, photonic, magnetic or ferroelectric materials. The electrical properties and performance of these materials/devices are of significant importance. Consequently, a multi-function 300mm Electro-Magneto-Optical Probe Station (Lot 1) is required to study the electrical properties of these materials and devices under a range of temperature conditions. The Probe station, in combination with the Device Parameter analyser (Lot 2), will enable users to perform electrical measurements (current voltage both in DC and in pulsed mode) at different temperatures and under magnetic field or illumination as required.