MOCVD epitaksijas procesa analīzes ārpakalpojums 22 mm GaAs substrātu fotokatoda heterostruktūras izstrādei un pilotparaugu izgatavošanai projektam KOM/2025/17
urn:tendersight:notices:types:lv-iub:competitionurn:tendersight:notices:types:lv-iub:competition2026/5SPSIA "Baltic Photonics"
Estimated value€32,000
DeadlineExpired21 Oct 2026, 11:00
Competition00 participants
Lots11 lot
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Key information
Identifier
Contract type
—
Deadline
21 Oct 2026, 11:00
CPV codes
—
Status
urn:tendersight:notices:procedure-statuses:lv-iub:submission-closed
Notice type
urn:tendersight:notices:types:lv-iub:competitionurn:tendersight:notices:types:lv-iub:competition
Estimated value
€32,000
Publication date
28 Sept 2026, 21:00
Overview
Paziņojums par finansējuma saņēmēja iepirkuma procedūru (mk-contract)
Aktualizēta tehniskā specifikācija 12.10.2026.
Iesniegšanas adrese: Muitas iela 1a, Rīga, LV-1010
Iemesla veids: update-add Grozījumi iepirkuma procedūras dokumentācijā iekļautajās prasībās
Līguma darbības termiņš (mēneši): 6
2e4e9593-5078-480a-9213-d9b01690baac
Lots1
Documentation0
The source system does not support document syncing.
Award criteria0
No procedure-level award criteria recorded.