Metrology SEM+FIB system
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Key information
Overview
The main purpose of this FIB/SEM equipment is to perform material milling (cutting), 3D characterization, and cross section analysis of epitaxially grown InP, InGaAs, InAlGaAs and InGaAsP layers on InP substrates. The structures may also contain polymer-based planarization layers, SiOx or SiNx dielectric layers and TiPtAu or NiGeAu metal layers. Levering van één SEM +FIB systeem
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Documentation5
- 198.7 KB
TN604044 - EF16 Aankondiging van een opdracht - algemene richtlijn, standaardregeling 20260727143716.pdf
PDF document
- 880.8 KB
Public Tender Metrology SEM+FIB.pdf
PDF document
- Part A.zip3.6 MB
Archive
- Part B.zip192.8 KB
Archive
- Part C.zip873.5 KB
Archive