Metrology SEM+FIB system
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Key information
Overview
The main purpose of this FIB/SEM equipment is to perform material milling (cutting), 3D characterization, and cross section analysis of epitaxially grown InP, InGaAs, InAlGaAs and InGaAsP layers on InP substrates. The structures may also contain polymer-based planarization layers, SiOx or SiNx dielectric layers and TiPtAu or NiGeAu metal layers. Levering van één SEM +FIB systeem
27 Jul 2026, 12:37
Publication date
Publication
17 Aug 2026, 10:30
Additional information request deadline
Deadline
07 Sept 2026, 10:00
Submission deadline
Deadline
None recorded.
Lots1
Documentation5
- 198.7 KB
TN604044 - EF16 Aankondiging van een opdracht - algemene richtlijn, standaardregeling 20260727143716.pdf
PDF document
- Part C.zip873.5 KB
Archive
- 880.8 KB
Public Tender Metrology SEM+FIB.pdf
PDF document
- Part B.zip192.8 KB
Archive
- Part A.zip3.6 MB
Archive