Metal/Backend Sputter system- second Tender
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Key information
Overview
Levering van één metal-backend sputtersysteem, geschikt voor het aanbrengen van Ti- en Au-lagen op 6-inch InP-wafers. Levering van één metaal-backend sputtersysteem.
Lots1
Documentation5
- 194.1 KB
TN608760 - EF16 Aankondiging van een opdracht - algemene richtlijn, standaardregeling 20260827162543.pdf
PDF document
- 890.7 KB
EU Open Tender Metal Backend Sputter System.pdf
PDF document
- Part C.zip873.3 KB
Archive
- Part A.zip1.0 MB
Archive
- Part B.zip192.5 KB
Archive