In flip-chip assembly, a semiconductor chip is electrically connected directly underside to a sensor via contact bumps. This requires a flip-chip die bonder, which places the chips flipped on the sensors with micrometer precision and enables various bonding technologies such as soldering, thermal bonding, and conductive adhesive bonding.

FAIR - Facility for Antiproton and Ion Research in Europe GmbH Planckstrasse 1 64291 Darmstadt, Planckstr. 1, Darmstadt, 64291, Darmstadt, Germany

#Bekanntmachungs-ID: CXS0YYEDYY9CE3AR# Tender shall be submitted electronically within the deadline via the German awarding platform DTVP. URL: http://www.dtvp.de/Center/ The forms and other documents to be completed, provided by FAIR, may be - either completed on the online tendering tool under the section "Documents to Be Completed" or - created and compiled separately by Candidate together with the other components of the tender (concepts or explanations etc.), then uploaded under the heading "Own Documents". However, Candidates should not fill in the forms online and upload them again separately, as this can result in transmission errors and increases the workload on both sides. In order to comply with the text form (in writing) according to § 126b BGB [transl.: German Civil Code] when submitting tender, Candidates must provide the following information: - In the case of natural persons, the full name (first name and surname) must be given (name of the declaring person in the tender form). In the case of legal entities and commercial companies and corporations, the name of the company and its legal form must be stated. In addition, the full name of the employee who is submitting the participation application on behalf of the company (name of the declaring person in the participation application form) must be stated. The insertion of a company logo is not sufficient. - In the case of Bidding Consortia, the declaring person according to § 126b BGB shall be the employee of the leading member who submits the participation application on behalf of the Bidding Consortium; besides, the form "Bidding Consortium Declaration" must be submitted. It should be noted that in the case of electronic submission, the text form according to § 126b BGB is only observed if the tender are transmitted in encrypted form via the awarding platform (cf. information on eVergabe). Submitting the participation application via email is not sufficient. In the case of incorrect/ incomplete information that violates the aforementioned formal requirements, tender will be excluded unless Candidate cannot be held responsible (§ 57 para. 1 nr. 1, para. 3 VgV). ******************************* Note: Weighting Weighting (Best possible rating is 10 and worst possible rating is 0) Price = 40 % Performance criteria = 60 % 1. Completeness and Quality of the Bid Documents = 20 % 2. Quality Assurance, Acceptance Testing and Documentation = 25 % 3. Delivery time, installation and training = 30 % 4. Repair Services and Sustainability = 25 % ________ Communication with Candidates takes place via the DTVP's tender platform. Questions must be sent to FAIR via DTVP and will are answered via DTVP. Questions posed orally or by telephone regarding the documents or the contractual object will not be answered; answers given orally or by telephone are not binding. -------------- Note: Electronic Invoicing "The XInvoicing format is accepted with additional transmission of the invoice as a -pdf-."

The Flip-chip Die bonder should include the following process modules: - Precision die bonding (face up) - Flip chip bonding (face down) - adapted system work table - chip and substrate heating with process gas enclosure - software-controlled bonding force module - ultrasonic bonding module - in-situ-monitoring with video camera - form generator for creating reference elements for face up alignment - tool tip changing module - three different tool tips - tool tip support including heater - dispenser module for paste and liquids - UV-curing module - die-eject module

FAIR - Facility for Antiproton and Ion Research in Europe GmbH Planckstrasse 1 64291 Darmstadt, Planckstr. 1, Darmstadt, 64291, Darmstadt, Germany

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